thermal gap pad TIF400 yellow

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thermal gap pad TIF400 yellow

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January 30, 2021

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Tags:

#Gap-Filler-Auflage #leitfähige Auflage der Hitze #Thermische Auflage 2W/MK

Brief: Discover the TIF400 Thermal Pad, a high-performance 2W/MK silicon thermal pad designed for telecommunication hardware. This yellow thermal gap pad offers excellent thermal conductivity, moldability, and low-stress applications. Perfect for RDRAM memory modules, automotive engine control units, and more.

Related Product Features:

Gute Wärmeleitfähigkeit mit einer Leistung von 2,0 W/mK.
Formbar für komplexe Teile und enge Räume.
Soft and compressible for low-stress applications.
Naturally tacky, eliminating the need for adhesive coatings.
Erhältlich in verschiedenen Stärken von 0,5 mm bis 5,0 mm.
Electrically isolating material for high-voltage applications.
UL94 V-0 flame rating for safety compliance.
Geeignet für Telekommunikationshardware und LED-beleuchtete Geräte

FAQs:

What is the thermal conductivity of the TIF400 Thermal Pad?

The TIF400 Thermal Pad has a thermal conductivity of 2.0 W/mK, making it highly effective for heat dissipation.
Can the TIF400 Thermal Pad be used in high-voltage applications?

Yes, the TIF400 is an electrically isolating material, making it suitable for high-voltage, bare-leaded devices.
What thickness options are available for the TIF400 Thermal Pad?

The TIF400 is available in thicknesses ranging from 0.5mm to 5.0mm, with standard and custom options upon request.