Liquid Metal: Injecting "Cold" Power into AI Chips, Unlocking New Boundaries of Computing Capacity

In the current era of exponential growth in AI computing power, every advancement in chip performance is accompanied by the severe challenge of heat dissipation. When traditional cooling solutions fail to meet the high-integration, high-power, and high-density heat dissipation requirements of AI chips, liquid metal, with its revolutionary material properties, has become the core underlying technology that breaks through the bottleneck of AI chip heat dissipation, laying a solid foundation for high-performance computing.

Liquid metal, Unlike ordinary metals that require heating to their melting point to become liquid, liquid metals have achieved a dual breakthrough of maintaining a stable liquid state at room temperature and low surface tension through cutting-edge new material technology and alloying processes. This unique property endows it with high fluidity and excellent thermal conductivity, while also offering advantages such as low evaporation rate, low leakage, safety, non-toxicity, and stable physical and chemical properties. It completely breaks through the performance ceiling of traditional heat dissipation materials, providing comprehensive high solutions for high-power heat dissipation scenarios. It is also suitable for the continuous development trend of increasing chip integration, ensuring the long-term stable operation of the heat dissipation system.

As the "gold medium" for cooling AI chips, the core product characteristics of liquid metals precisely meet the demanding cooling requirements of AI computing power:

Excellent thermal conductivity:
The thermal conductivity is far superior to that of traditional thermal pastes and thermal gels. The heat conduction efficiency has been exponentially enhanced, enabling the rapid discharge of the massive heat generated by AI chips, preventing the accumulation of heat that leads to performance degradation and computational power loss, and keeping the chips always in a high operating state.
Non-toxic, environmentally friendly and safe, meeting RoHS requirements:
By eliminating the potential harmful substances in traditional heat dissipation materials, it is safe, non-toxic, environmentally friendly, and fully complies with RoHS environmental protection regulations. It meets the environmental protection standards for the entire lifecycle of electronic devices, has no safety hazards, and is more reassuring to use.
Excellent long-term stability:
The physical and chemical properties are highly stable, unaffected by temperature, humidity, and usage duration. It does not age, decompose, or lose effectiveness over a long period of use. There is no need for frequent replacement and maintenance, ensuring that the AI chip cooling system maintains stable cooling performance throughout long-term high-load operation.
Fully fills the contact surface, creating a low thermal resistance:
With low surface tension and high fluidity, the liquid metal can completely fill the tiny gaps and uneven interfaces between the chip and the heat dissipation device, eliminating the thermal resistance caused by air gaps, achieving "zero gap" heat conduction, significantly reducing interface thermal resistance, and enabling higher efficiency and smoother heat transfer.
Not prone to volatilization:
At room temperature, it has no volatilization or leakage risks, avoiding the degradation of heat dissipation performance and equipment pollution caused by the volatilization of traditional liquid heat dissipation media, ensuring a stable and lasting heat dissipation effect, and meeting the demand for 7×24-hour uninterrupted operation of AI chips.

From the AI servers in data centers, to the intelligent terminals at the edge of computing, and to the on-board chips for autonomous driving, the liquid metal cooling technology is fully penetrating the core scenarios of AI computing power. It not only solves the "cooling anxiety" of high-power AI chips, but also, through bottom-level technological innovation, supports the continuous improvement of chip integration and the continuous breakthrough of computing power, injecting continuous "cool" power into the in-depth application and future development of AI technology, allowing every bit of computing power to be fully released and stably output.