The new benchmark for immersion cooling heat dissipation: TIF100C series thermal pads - fully compatible with liquids and long-lasting stability

With the rapid popularization of AI computing power, high-performance computing, new energy vehicles, and high-density data centers, immersion liquid cooling has become a core solution for breaking through the heat dissipation bottleneck, reducing PUE, and enhancing equipment reliability. However, when continuously immersed in insulating cooling fluids such as PAO, mineral oil, and fluorinated liquids, traditional thermal interface materials are prone to problems such as swelling, cracking, peeling, and attenuation of thermal conductivity, which directly affect the long-term stability of chips and the entire system.

The ZIITEK TIF100C immersion series is a flexible thermal conductive and insulating material made of ceramic-filled silicone rubber. It is specifically designed for heat-generating devices - for filling the gap between liquid cooling plates and metal bases. It features high thermal conductivity, high insulation, self-adhesion, and high compressibility, and can perfectly cover uneven surfaces. In the immersion environment, it can continuously and stably conduct heat, ensuring the long-term full-load operation of high-power devices.

1.Fully compatible with various liquid heights, verified through multiple types of immersion liquids.

The TIF100C series adopts a liquid-resistant silicone rubber matrix combined with a highly stable ceramic filler formula. After long-term aging and immersion tests, it demonstrates excellent compatibility with various mainstream immersion cooling fluids such as PAO and mineral oils, fluorinated liquids, etc.:
There is no significant swelling, contraction, delamination, or powdering
The surface is not sticky, no precipitation, and no oil sludge
The insulation performance and mechanical performance retention rate are high
It does not contaminate the cooling fluid, does not affect the heat exchange and circulation of the system
It meets the strict chemical compatibility requirements of immersion liquid cooling systems in data centers, HPC, electric control of new energy vehicles, industrial power supplies, etc.

2. Long-lasting stability, with no loss of thermal conductivity

In the immersion environment, the main concerns are the decrease in thermal conductivity and the increase in interface thermal resistance, which can lead to overheating and frequency reduction of the chip.
Stabilize the cross-linked structure of the silicone rubber
High-weather-resistant ceramic filler system
Outstanding anti-aging, anti-decomposition, and anti-oil immersion properties
Achieve stable thermal conductivity of 10.0 W/m·K under long-term immersion conditions, without an increase in interface thermal resistance, without a reduction in heat dissipation efficiency, and ensure the long-term stable output of GPU/CPU/power devices.