Herkunftsort: | China |
Markenname: | Ziitek |
Zertifizierung: | UL & RoHS |
Modellnummer: | TIF7120RUS-Reihe |
Min Bestellmenge: | 1000 Stück |
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Preis: | 0.1-10 USD/PCS |
Verpackung Informationen: | 24*13*12cm Kartons |
Lieferzeit: | 3-5 Arbeitstage |
Zahlungsbedingungen: | T/T |
Versorgungsmaterial-Fähigkeit: | 1000000 Stück/Monat |
Produktbezeichnung: | Isolierung für Laptops Elektroleitendes Silizium-Wärmepad | Anwendung: | Laptop- und elektrische Kühlung |
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Wärmeleitfähigkeit: | 8.5W/mK | Schlüsselwörter: | Wärmeleitfähiges Silikonpad |
Eigenschaften: | Erhältlich in verschiedenen Thinkness-Optionen | Flam-Klassifikation: | 94 V-0 |
Härte: | 20 Ufer 00 | Farbe: | Grau |
Denkbarkeitsbereich: | 3.0mmT | ||
Hervorheben: | Electric Conductive Silicone Thermal Pad,Laptop Insulation Silicone Thermal Pad,Thermal Conductive Silicone Pad |
Laptop Insulation Electric Conductive Silicon Thermal Pad Thermal Conductive Silicone Pad
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TIF®7120RUS Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.
Features:
> Excellent thermal conductivity 8.5W/mK
> Moldability for complex parts
> Broad range of hardnesses available
> Moldability for complex parts
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> CPU
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
Typical Properties of TIF®7120RUS Series | ||
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone | ***** |
Specific Gravity | 3.2 g/cc | ASTM D792 |
Thickness | 3.0mm | ASTM D374 |
Hardness | 20 (Shore 00) | ASTM 2240 |
Continuos Use Temp | -40 to 200℃ | ****** |
Dielectric Breakdown Voltage | ≥3500 VAC | ASTM D149 |
Dielectric Constant | 5.1~6.1 MHz | ASTM D150 |
Volume Resistivity(Ohm-cm) | >1.0*1.012 | ASTM D257 |
Fire rating | 94 V0 | UL (E331100) |
Thermal conductivity | 8.5W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Ansprechpartner: Dana Dai
Telefon: +86 18153789196