Name: High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF050-11-1
Price: 49.10 USD
Availability: InStock

Startseite Produkte Wärmeleitendes Gel

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

Produktdetails:

Herkunftsort:	CHINA
Markenname:	Ziitek
Zertifizierung:	UL
Modellnummer:	TIF050-11-1

Zahlung und Versand AGB:

Min Bestellmenge:	1000Rohre
Preis:	0.1-100USD/KG
Verpackung Informationen:	300cc/PCS, 6PCS/Box
Lieferzeit:	3-8 Arbeitstage
Zahlungsbedingungen:	T/t
Versorgungsmaterial-Fähigkeit:	10000KG/Month

Kontakt

Ausführliche Produkt-Beschreibung

Produktname:	Wärmeleitfähiges Gel mit hoher Leitfähigkeit, 5,0 W/MK-Isolierung, wärmeleitendes Gel, geeignet für	Spezifische Schwerkraft:	3.25 g/cc
Farbe:	Dunkelgrau	Materail:	Keramisches gefülltes Siliziummaterial
Durchbruchspannung (V/mm):	≥ 6000	Wärmeleitfähigkeit:	5.0W/m-k
Stichwort:	Thermalgel	Anwendung:	PCB-Anwendungen
Dielektrische Konstante @1MHz:	7,7

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications

TIF^®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in high-temperature environments. Its low-stress characteristics are particularly suitable for electronic devices that require high precision and high reliability, effectively reducing the mechanical stress on sensitive components during assembly and operation, ensuring the long-term stable operation of products in various application environments.

Feature

> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties

Application

> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

TIF^®050-11-1 Typical Properties
Property	Value	Test method
Color	Dark Gray	Visual
Construction & Composition	Ceramic filled silicon material	******
Density(g/cm³)	3.25g/c	ASTM D792
Thermal conductivity	5.0W/mK	ASTM D5470
Breakdown Voltage (V/mm)	≥6000	ASTM D149
Dielectric constant @1MHz	7.7	ADTM D150
Flame Rating	V-0	UL 94
Volume resistivity(Ohm.cm)	8.0 X 10¹³	ASTM D257

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Größe und Tag: