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Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Produktdetails:
Herkunftsort: China
Markenname: Ziitek
Zertifizierung: UL & RoHS
Modellnummer: TIF100-32-05U
Zahlung und Versand AGB:
Min Bestellmenge: 1000 Stück
Preis: 0.1-10 USD/PCS
Verpackung Informationen: 24*23*12cm Kartons
Lieferzeit: 3-5 Werktage
Zahlungsbedingungen: T/T
Versorgungsmaterial-Fähigkeit: 1000000 PCs/Monat
Kontakt
Ausführliche Produkt-Beschreibung
Produktname: Ultraweiches Thermo-Silikon-Pad, 3,2 W, hohe Leitfähigkeit, Lückenfüller für KI-Server, GPU-Kühlung, Dickenbereich: 0,25–5,0 mm T
Anwendung: KI-Server, GPU-Kühlung, Wechselrichter Farbe: Blau
Durchbruchspannung (V/mm)): ≥5500 Konstruktion: Mit Keramik gefüllte Silikonelastomer
Brandbewertung: UL94 V-0 Wärmeleitfähigkeit: 3.2W/m-K
Dielektrische Konstante @1MHz: 3.5 Schlüsselwörter: Thermisch Silikon-Pad

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features:
 

> Good thermal conductivity: 3.2W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability

 


Applications

 

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Heat pipe thermal solutions

 

 

Typical Properties of TIF®100-32-05U Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.5)

0.030~0.200 (0.75~5.0) ASTM D374
Hardness (Shore OO) 65 27 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 3.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.2 W/m-K ASTM D5470
3.2 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010"(0.25 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Kontaktdaten
Dongguan Ziitek Electronical Material and Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: +86 18153789196

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