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Low Density Thermal Pad For High Speed Networks And AI Servers

Low Density Thermal Pad For High Speed Networks And AI Servers

Produktdetails:
Herkunftsort: China
Markenname: Ziitek
Zertifizierung: UL & RoHS
Modellnummer: TIF100-15-11S-D
Zahlung und Versand AGB:
Min Bestellmenge: 1000 Stück
Preis: 0.1-10 USD/PCS
Verpackung Informationen: 24*13*12 cm Kartons
Lieferzeit: 3-5 Werktage
Zahlungsbedingungen: T/T
Versorgungsmaterial-Fähigkeit: 1000000 PCs/Monat
Kontakt
Ausführliche Produkt-Beschreibung
Produktname: Wärmeleitpad mit geringer Dichte für Hochgeschwindigkeitsnetzwerke und KI-Server Dickenbereich: 0,250–5,0 mm (0,010–0,20 Zoll)
Farbe: Dunkelgrau Härte: 65 Ufer 00
Dichte: 20,0 g/cm3 Schlüsselwörter: Thermalpad
Anwendung: Hochgeschwindigkeitsnetzwerke und KI-Server Wärmeleitfähigkeit: 1,5 W/m-K

Low Density Thermal Pad For High Speed Networks And AI Servers

 

Products Description

 

TIS®100-15-11S-D Series is an innovative low-density thermal pad that offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and outstanding ease of use, delivering effective heat transfer and basicphysical protection for a wide range of electronic components while achieving lightweight performance.

Features:

 

> Low density
> Good thermal conductivity
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:

 

> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

> High Speed Networks And AI Servers

 

Typical Properties of TIF®100-15-11S-D Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.0 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.5)

0.030~0.200

(0.75~5.0)

ASTM D374
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 5.2 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity(W/m.K) 1.5 ASTM D5470
Fire rating V-0 UL 94 (E331100)

 

Product Specifications

Standard Thickness: 0.010" (0.250 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" 406 mm×406 mm)
 
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Low Density Thermal Pad For High Speed Networks And AI Servers 0

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Kontaktdaten
Dongguan Ziitek Electronical Material and Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: +86 18153789196

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