Name: Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF500-50-10U
Price: 4.10 USD
Availability: InStock

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Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material

Produktdetails:

Herkunftsort:	China
Markenname:	Ziitek
Zertifizierung:	UL & RoHS
Modellnummer:	TIF500-50-10U

Zahlung und Versand AGB:

Min Bestellmenge:	1000 Stück
Preis:	0.1-10 USD/PCS
Verpackung Informationen:	241312 cm Kartons
Lieferzeit:	3-5 Werktage
Zahlungsbedingungen:	T/T
Versorgungsmaterial-Fähigkeit:	1000000 PCs/Monat

Kontakt

Ausführliche Produkt-Beschreibung

Produktname:	Weiches Wärmeableitungs-Lückenfüller, wärmeleitendes Silikon-Pad, GPU-CPU-LED-Wärmeschnittstellenmat	Anwendung:	GPU -CPU -LED -Wärmeabteilung
Aufbau & Zusammensetzung::	Mit Keramik gefülltes Silikonelastomer	Härte:	27 Ufer 00
Dichte:	3,4 g/cm³	Wärmeleitfähigkeit:	5.0W/m-k
Farbe:	grau	Dickenbereich:	0,25–5,0 mm/(0,010–0,20 Zoll)
Schlüsselwörter:	Weiche Wärmeleitpads

Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material

Products Description

TIF^®500-50-10US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features:

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives

> Good insulation performance
> RoHS compliant
> UL recognized

Applications:

> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power

Typical Properties of TIF^®500-50-10U Series
Property	Value		Test method
Color	Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.4		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	27 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	5.0 W/m-K		ASTM D5470
	5.0 W/m-K		ISO22007

Soft Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Interface Material 0

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

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