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Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics

Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics

Produktdetails:
Herkunftsort: China
Markenname: Ziitek
Zertifizierung: UL and RoHs
Modellnummer: TIF100-50-05E Wärmeleitpad
Dokumentieren: TIF100-50-05E_Data Sheet.pdf
Zahlung und Versand AGB:
Min Bestellmenge: 1000 Stk
Preis: 0.1-10 USD/PCS
Verpackung Informationen: 24*13*12cm Karton
Lieferzeit: 3-8 Werktage
Zahlungsbedingungen: T/T
Versorgungsmaterial-Fähigkeit: 100.000 Stück/Monat
Kontakt
Ausführliche Produkt-Beschreibung
Produktname: Wärmeleitfähiges CPU-Wärmeleitpad mit 5,0-W-MK-Gap-Pad-Material, geeignet für tragbare Elektronikger Konstruktion: Mit Keramik gefülltes Silikonelastomer
Schlüsselwörter: CPU-Wärmepad Dicke: 0,010 bis 0,200 Zoll (0,25 bis 5,0 mm)
Teilenummer: TIF100-50-05E Härte: 65/35 Shore 00
Wärmeleitfähigkeit: 5.0W/mk Farbe: Blau
Probe: frei Anwendung: Portable Elektronik

Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material,  thermal grease etc. UL94 V-0, SGS and ROHS are compliant. 


Products description

TIF®100-50-05E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features 

> Good thermal conductive: 5.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Heat pipe thermal solutions
> Memory Modules 
> Mass storage devices 
> Automotive electronics 
> Set top boxes


Key attributes 


Typical Properties of TIF®100-50-05E Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00

35 Shore 00

ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 6.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 5.0 ASTM D5470
5.0 ISO22007


Product Specifications 


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics 0

Why Choose us ? 

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ:


Q: How long is your delivery time? 

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. 


Q: Do you provide samples ? is it free or extra cost? 

A: Yes, we could offer samples free of charge.


Q: What's the thermal conductivity test method given on the data sheet ? 

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.  

Kontaktdaten
Dongguan Ziitek Electronical Material and Technology Ltd.

Ansprechpartner: Dana Dai

Telefon: +86 18153789196

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