Name: High Reliability And Stability Thermal Conductive Gap Filler Pads Ideal For Heat Dissipation In Electronic And Industrial Equipment
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-65-11US
Price: 4.10 USD
Availability: InStock

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High Reliability And Stability Thermal Conductive Gap Filler Pads Ideal For Heat Dissipation In Electronic And Industrial Equipment

Produktdetails:

Herkunftsort:	China
Markenname:	Ziitek
Zertifizierung:	UL and RoHs
Modellnummer:	TIF100-65-11US
Dokumentieren:	TIF100-65-11US_Data Sheet .... ..pdf

Zahlung und Versand AGB:

Min Bestellmenge:	1000 Stk
Preis:	0.1-10 USD/PCS
Verpackung Informationen:	241312cm Karton
Lieferzeit:	3-8 Werktage
Zahlungsbedingungen:	T/T
Versorgungsmaterial-Fähigkeit:	100.000 Stück/Monat

Kontakt

Ausführliche Produkt-Beschreibung

Produktname:	Wärmeleitende Lückenfüller mit hoher Zuverlässigkeit und Stabilität, ideal für die Wärmeableitung in	thermisches leitfähiges:	6,5 W/mK
Konstruktion:	Mit Keramik gefülltes Silikonelastomer	Härte:	65/20 Shore 00
Probe:	Kostenlose Probe	Farbe:	Dunkelgrau
Dicke:	0,010 "(0,25 mm) ~ 0,200" (5,0 mm)	Dichte:	3,45 g/cm³
Schlüsselwörter:	Silikon-Thermopad	Anwendung:	Zur Wärmeableitung in elektronischen und industriellen Geräten

High Reliability And Stability Thermal Conductive Gap Filler Pads Ideal For Heat Dissipation In Electronic And Industrial Equipment

Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Products description

The TIF^®100-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

> Good thermal conductive 6.5W/mK
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Embedded Motherboard
> Industrial visual inspection equipment
> Graphics card cooling module
> Charging pile power module
> Central control screen

> Home appliance industry
> Power module
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

Key attributes

Typical Properties of TIF^®100-65-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.45		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	7.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity(W/m-K)	6.5		ASTM D5470
	6.5		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High Reliability And Stability Thermal Conductive Gap Filler Pads Ideal For Heat Dissipation In Electronic And Industrial Equipment 1

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

Größe und Tag: