Name: Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-15-11F-Serie
Price: 4.10 USD
Availability: InStock

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Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

Produktdetails:

Herkunftsort:	China
Markenname:	Ziitek
Zertifizierung:	UL & RoHS
Modellnummer:	TIF100-15-11F-Serie
Dokumentieren:	TIF100-15-11F_Data Sheet.pdf

Zahlung und Versand AGB:

Min Bestellmenge:	1000 Stück
Preis:	0.1-10 USD/PCS
Verpackung Informationen:	241312cm Kartons
Lieferzeit:	3-5 Werktage
Zahlungsbedingungen:	T/T
Versorgungsmaterial-Fähigkeit:	1000000 PCs/Monat

Kontakt

Ausführliche Produkt-Beschreibung

Produktname:	Thermischer Lückenfüller, der entwickelt wurde, um Luftspalte zu füllen und die Wärmeübertragung zwi	Denkmalsbereich:	0,010 "(0,25 mm) ~ 0,200" (5,0 mm)
Zertifizierung:	RoHS and UL recognized	Probe:	Muster verfügbar
Flam -Bewertung:	94 v0	Härte:	65/60 Shore 00
Wärmeleitfähigkeit:	1,5W/mk	Farbe:	Dunkelgrau
Schlüsselwörter:	Wärmespaltfüller

Thermal Gap Filler Engineered To Fill Air Gaps And Enhance Heat Transfer Between Electronic Components And Cooling Plates

TIF^®100-15-11F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is ideal for applications requiring a balance between heat dissipation, insulation, and mechanical stability.

Key Features

Excellent thermal conductivity: 1.5 W/mK
Soft and compressible for low stress applications
Naturally tacky needing no further adhesive coating
Available in various thicknesses
Broad range of hardnesses available

Applications

Cooling components to chassis or frame

High speed mass storage drives

LED TV and LED-lit lamps

RDRAM memory modules

Micro heat pipe thermal solutions

Display cards and motherboards

Notebook computers and power supplies

Telecommunication hardware

Memory modules

Home appliance industry

Power module

Wearable devices

Technical Specifications of TIF^®100-15-11F Series

Property	Value	Test Method
Color	Dark Gray	Visual
Construction	Ceramic filled silicone elastomer	-
Density (g/cm³)	2.2	ASTM D792
Thickness Range	0.010"~0.020" \| 0.030"~0.200" 0.25~0.50mm \| 0.75~5.00mm	ASTM D374
Hardness (Shore 00)	65 \| 60	ASTM 2240
Operating Temperature	-40 to 200℃	-
Breakdown Voltage (V/mm)	≥5500	ASTM D149
Dielectric Constant @ 1MHz	4.5	ASTM D150
Volume Resistivity	＞1.0*10¹² Ohm-meter	ASTM D257
Flame Rating	V-0	UL 94 (E331100)
Thermal Conductivity	1.5 W/m-K	ASTM D5470 / ISO22007

Product Dimensions

Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with 0.010" (0.25 mm) increments

Standard Size: 16" * 16" (406 mm * 406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging & Lead Time

Packaging: Protected with PET film or foam, paper card separation between layers, export carton packaging, customizable to customer requirements.

Lead Time: For quantities of 5000 pieces, delivery time is negotiable.

Frequently Asked Questions

Are you a trading company or manufacturer?
We are a manufacturer based in China.

Do you accept custom orders?
Yes, we welcome custom orders. We can customize dimensions, shapes, colors, and apply adhesive coatings or fiberglass reinforcement as required. Please provide drawings or detailed specifications.

How much do the pads cost?
Pricing depends on size, thickness, quantity, and specific requirements such as adhesive applications. Please provide these details for an exact quote.

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