UL Recognized Premium Soft Thermal Conductivity 1.5W/MK Silicone Thermal Pad For Unmanned Aerial Vehicle(UAV)

UL Recognized Premium Soft Thermal Conductivity 1.5W/MK Silicone Thermal Pad For Unmanned Aerial Vehicle(UAV)

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

The TIF^®100-01S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Good thermal conductive: 1.5W/mK

> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> LED TV / LED Lit Lamps
> Automotive engine control units
> SAD-DC Power Adapters
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Micro heat pipe thermal solutions
> Memory Modules

> Routers

> Telecommunication hardware

> Mainboard/mother board

> CPU
> Display card
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)